Introduction to Integrated Circuit Packaging   Integrated circuit packaging technologies have evolved throughout the years to the point where hundreds of IC package types are available today.    Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc. However, as the semiconductor industry develops smaller and more powerful devices, a ‘system in package’ (SiP) type of solution is becoming the preferred choice, where all elements are placed into a single package or modu ..read more

This interview was held with Bram De Muer, CEO of ICsense       Tell me a bit about your background? How did you first get started with ICsense?   I am a microelectronics engineer by education. Engineering has always been in my blood, whether it was constructing novel Lego creations or dissecting old electronic equipment. The high level of abstraction in microelectronics fascinated me—the fact that incredibly complex signal processing and computation occur within a tiny piece of silicon that appears to be doing nothing at all.   This curiosity led me to pursue a PhD a ..read more

Shanghai, China, March 28, 2024 — VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) IP solution has achieved full compliance with LE Audio specification, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). This solution is applicable to mobile phones, Bluetooth earphones including True Wireless Stereo (TWS) earphones, speakers, and other extensive audio application scenarios. The declaration details can be accessed on Bluetooth SIG’s website by searching for its Qualified Design ID (QDID: 206187).   LE ..read more

Like architects shaping skylines, VLSI engineers are the masterminds behind the intricate circuits that power modern electronics. In the world of microelectronics, they play a pivotal role, crafting the very foundation upon which today’s technology thrives.   Core Responsibilities in Chip Creation: VLSI engineers are tasked with developing and refining circuit designs, translating conceptual frameworks into physical, functioning silicon entities. At the heart of their work lies VLSI (Very Large Scale Integration) design, where they meticulously architect complex integrated circuits tailor ..read more

Like a master tailor crafting a bespoke suit, an ASIC engineer designs circuits tailored for specific applications with precision and expertise.     Analogous to architects who shape skylines, ASIC design engineers sculpt the electronic landscape by creating custom integrated circuits – the foundation upon which today’s technology stands.   Unveiling the ASIC Engineer’s World     An ASIC Engineer embodies the confluence of innovative vision and meticulous engineering. In their realm, these specialized professionals harness a myriad of skills, tools, and technologies to ..read more

An Application Specific Integrated Circuit (ASIC) is a specialized integrated circuit crafted for a particular use or purpose. Typically, ASICs are tailored for products targeted for mass production, consolidating necessary electronics onto a single chip.     ASIC stands for “Application Specific Integrated Circuit.”   Despite the substantial initial design cost (known as NRE), ASICs can prove cost-effective for high-volume applications. This is especially true when a significant portion of a system can be integrated into a single ASIC, reducing the need for external components ..read more

In order to cater to the computing demands for high performance computing (HPC) and artificial intelligence (AI), a need for a scalable package was felt. Chip-on-wafer-on-substrate (CoWoS) refers to the advanced packaging technology that offers the advantage of a larger package size and more I/O connections. It allows 2.5D and 3D stacking of components to enable homogenous and heterogenous integration. Previous systems faced memory limitations and contemporary data centers employ the use of high bandwidth memory (HBM) to enhance memory capacity and the bandwidth. CoWoS technology allows hetero ..read more

Meyreuil, France—March 19, 2024—Presto Engineering, a leading European expert in application-specific integrated circuit (ASIC) design, engineering and production services, will exhibit its turnkey ASIC design and production services at Embedded World, taking place April 9-11, 2024, in Nuremberg, Germany. Presto CEO, Cedric Mayor, will present “Going ASIC – Myth or Dream?” on April 9, 12:00-12:30pm in the Exhibitor Forum, Halle 5-210, where he will dive into the reasons and methods that make ASIC-enabled projects a game changer.   “Going with an ASIC has historically been perceived as ris ..read more

Mar. 12, 2024 —- The latest TrendForce report reveals a notable 7.9% jump in 4Q23 revenue for the world’s top ten semiconductor foundries, reaching $30.49 billion. This growth is primarily driven by sustained demand for smartphone components, such as mid and low-end smartphone APs and peripheral PMICs. The launch season for Apple’s latest devices also significantly contributed, fueling shipments for the A17 chipset and associated peripheral ICs, including OLED DDIs, CIS, and PMICs. TSMC’s premium 3nm process notably enhanced its revenue contribution, pushing its global market sh ..read more

Leuven, March 1st 2024 – “In February 2004, we started ICsense with a team of 4 people and today ICsense employs over 100 dedicated chip experts”, says CEO Bram De Muer. “We’re really proud to have the best fab-independent European IC design team with world-class expertise in analog, digital, mixed-signal and high-voltage design. Thanks to our strong company culture and reputation, we have an employee retention rate of more than 90%, which is among the highest in the IC design community.”     Over the years, ICsense has gained a strong reputation in state-of-the-art A ..read more